Cooling system for semiconductor manufacturing and testing processes

ABSTRACT

A cooling system for providing a desired environment for a semiconductor manufacturing and/or testing processes includes a vortex unit and a semiconductor processing device suitable for performing a semiconductor processing function. The vortex unit includes an air inlet for receiving compressed air, a first air exhaust for outputting an air stream having a temperature greater than the received compressed air, and a second air exhaust for outputting an air stream having a temperature lower than the received compressed air, and a dry air tube enclosing the second air exhaust and connecting to the air compressor unit and the vortex unit. Since the dry air continuously flows surrounding the cold air tube, no water will be condensed around the cold air tube. Accordingly, no pollution and damages by the condensed water will happen to the manufactured or tested products.

CROSS REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of U.S. ProvisionalApplication Ser. No. 61/295,226, filed on Jan. 15, 2010. The fulldisclosures of the above-identified application are incorporated hereinby reference.

TECHNICAL FIELD

The present invention generally relates to a cooling system forsemiconductor manufacture and/or testing processes, and moreparticularly to a vortex cooling system for providing desiredenvironmental conditions in manufacturing and/or testing semiconductordevices.

BACKGROUND

The manufacturing and testing of semiconductor devices is a laboriousprocess. Because of the complexity of the process, a high failure ratemay be encountered during the manufacture of the devices. Thus, thedevices must be tested extensively to ensure operation within desiredparameters. Additionally, testing of the semiconductor device mayrequire not only the testing of the ability of the semiconductor toperform desired operations, but also the ability of the semiconductor toperform the operations in contemplated environmental conditions.

Semiconductor devices may encounter a wide range of environmentalconditions. From extreme heat to cold, and every temperature in between,users desire the operation of the semiconductor within desiredparameters for the contemplated environmental conditions. Therefore, itmay also be desirable to test the semiconductor devices within thecontemplated operational temperature range to ensure the robustness ofthe device.

For example, conventional methods used to test a semiconductor deviceinvolve a vortex tube for cooling the environment of a desired process,such as testing of a device. Compressed air is directed into the vortextube such that the cold air exhausts onto the testing and/ormanufacturing of semiconductor devices.

However, because the temperature difference between the environment andthe vortex cold air outlet, water may often condense surrounding theouter surface of the vortex cold air outlet tube. The condensed watermay drop from the vortex tube to the manufacturing and/or testing areasand cause pollution and even damages to the manufactured or testedproducts. In general, the vortex tube may be encapsulated in insulatingmaterial, however, water condensation could still happen even though thevortex tube has been encapsulated by insulation material.

SUMMARY

Accordingly, the object of the present invention is to provide a coolingsystem for providing a desired environment for the testing and/ormanufacturing of semiconductor devices in an efficient andcost-effective manner without moving parts, electricity, refrigerants,and without condensed water pollution and damages.

In one aspect of the present invention, a vortex tube includes an airinlet for receiving compressed air, a first air exhaust for outputtingan air stream having a temperature greater than the received compressedair, and a second air exhaust for outputting an air stream having atemperature lower than the received compressed air, and a third airinlet to the heat insulation casing system and exhaust air with thesecond exhaust of the vortex tube. The semiconductor processing deviceis connected to the second air exhaust of the vortex tube so that thesemiconductor processing device receives a cooled air stream from thevortex tube, the cooled air stream providing an environment suitable forenabling the semiconductor processing device to perform thesemiconductor processing function. The third air conducting to the outerposition of the second outlet of the vortex tube serves as a heatinsulation layer.

It is to be understood that both the forgoing general description andthe following detailed description are exemplary and explanatory onlyand are not restrictive of the invention as claimed. The accompanyingdrawings, which are incorporated in and constitute a part of thespecification, illustrate an embodiment of the invention and togetherwith the general description, serve to explain the principles of theinvention.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiments will be discussed herein with reference to theaccompanying drawings, wherein elements having the same referencenumeral designations represent like elements throughout and wherein:

FIG. 1 is an illustration of an embodiment of the cooling system forsemiconductor manufacturing and testing processes in accordance with thepresent invention.

DETAILED DESCRIPTION

In the following detailed description, for purposes of explanation,numerous specific details are set forth in order to provide a thoroughunderstanding of the present invention. It will be apparent, however,that the present invention may be practiced without these specificdetails. In other instances, well-known structures and devices areschematically shown in order to simplify the drawing.

Referring now to FIG. 1, a vortex unit 1 suitable for cooling inaccordance with the present invention is shown. A vortex tube 2 receivesa stream of compressed air 3 and separates the stream into a hot airstream 4 and a cool air stream 5. The stream of compressed air 3 issupplied from an air compressor 12 or central compressed air system inthe factory. The cylindrical generator 6 causes the air to rotate as afirst air stream. The rotating air is forced down the end of the tubeagainst the inner walls of the tube. A portion of the first air streamat the periphery layers 7 exits the tube, preferably through acontrolling valve 14, and is exhausted as the hot air stream 4. Theremaining air returns through the center of the first air stream at theperiphery layers 7 as a second air stream at the central layers 8, andthe second air stream at the central layers 8 moves in the oppositedirection slower that the first air stream at the periphery layers 7.Heat in the second air stream at the central layers 8 is transferred tothe faster moving first air stream at the periphery layers 7 which coolsthe second air stream at the central layers 8. The second cooled airstream at the central layers 8 passes through the center of thecylindrical generator 6, and exits through an exhaust port as the cooledair 5. For the cooling purpose, the cooled air 5 exhausts onto thetesting and/or manufacturing of semiconductor devices 9. The mechanismof the vortex tube 2 is that the angular velocity in the vortex tube 2is low at the periphery layers 7 and very high at the central layers 8.Friction between the central and periphery layers 7 reduces all the airto the same angular velocity as in a solid body. This causes the innerlayers to slow down and outer layers to speed up. As a result of thatthe inner parts lose part of their kinetic energy and their totaltemperature decrease. The periphery layers 7 receive the energy from thecentral layers 8. So the cooled air 5 is so formed in the cold air tube10. The outlet of the cold air tube 10 is connected to the chuck 11 tocool down the environment of the semiconductor device 9.

Referring to FIG. 1, an embodiment of the present invention is shownwherein the cold air tube 10 of the vortex unit 1 is enclosed with a dryair tube 14, wherein a dry air 13 is supplied by the air compressor 12or central compressed air system in the factory. The temperature of dryair 13 is between the hot air's 4 and the cold air's 5. The dry air 13continuously flows surrounding the cold air tube 10 and then is directedout of the cold air tube 10. Since the dry air 13 continuously flowssurrounding the cold air tube 10, no water will be condensed surroundingthe cold air tube 10 to drop down onto the manufacturing and/or testingareas. Accordingly, no pollution and damages by the condensed water willhappen to the manufactured or tested device 9 and the manufacturingand/or testing machines 19. The dry air 13 in the dry air tube 14becomes a good temperature insulation layer and the dry air tube 14 isso designed as not to interfere the temperature behavior of the cold airtube 10.

Additionally, a controlling valve 15 located in the hot air exhaust ofthe vortex tube 2 may be used to control the cold fraction. Thepercentage of total input air to the vortex tube 2 that is directed tothe cold end 16 is the “Cold Fraction”. Thus, by using a valve 15controllable by a user, the vortex tube 2 may supply a variety ofatmospheres as desired by a user. Adjusting the hot air outlet sets theflow rate and temperature at the cold end 16. The temperature “rise” atthe hot end 17 and temperature “drop” at the cold end 16 of a vortextube 2 at various input pressures and “Cold Fraction” setting. The morehot air stream 4 out at the hot end 17 and reduces the cold air stream5, that is to lower the “Cold Fraction”, the cold air's temperature dropmore at the cold end 16. The less hot air stream 4 out at the hot end 17and increase the cold air stream 5, that is to raise the “ColdFraction”, the cold air's temperature drop less at the cold end 16. Inanother aspect, change the flow rate or pressure of the inlet compressedair 3 will also change the temperature of the cold air stream 5 and thehot air stream 4. Increase the inlet pressure at lower cold fractionwill make cold air's 5 temperature drop more but the hot air stream's 4temperature raise few. On the contrary, increase the inlet pressure athigher cold fraction will make cold air's 5 temperature drop few but thehot air stream's 4 temperature raise more. The ON/OFF controller 18 isconnected to the air compressor 12 and the manufacturing and/or testingmachines 19 to control the operation of the cooling system. Thecontrolling valve 15 is connected to the temperature sensor 20 on themanufacturing and/or testing machines 19.

It is believed that the cooling system of the present invention and manyof its attendant advantages will be understood by the forgoingdescription. It is also believed that it will be apparent that variouschanges may be made in the form, construction and arrangement of thecomponents thereof without departing from the scope and spirit of theinvention or without sacrificing all of its material advantages. Theform herein before described being merely an explanatory embodimentthereof. It is the intention of the following claims to encompass andinclude such changes.

1. A cooling system for providing a desired environment for asemiconductor manufacturing and testing process, comprising: a vortexunit having an air inlet for receiving a compressed air; a hot airexhaust tube for outputting an air stream having a temperature greaterthan the received compressed air; a cold air exhaust tube for outputtingan air stream having a temperature lower than the received compressedair; a dry air tube enclosing the cold air exhaust tube, wherein the dryair inside the dry air tube continuously flows surrounding the cold airtube; and an air compressor system for supplying compressed air to thevortex tube and the dry air tube.
 2. A cooling system as described inclaim 1, wherein the vortex unit further comprises a valve constructedon the end of the hot air exhaust tube to control the cold fraction ofthe hot air in the hot air exhaust tube and the cold air in the cold airexhaust tube.
 3. A vortex cooling system for providing a desiredenvironment for a semiconductor manufacturing and testing process,comprising: a vortex unit having an air inlet for receiving a compressedair; a hot air exhaust tube for outputting an air stream having atemperature greater than the received compressed air; a cold air exhausttube for outputting an air stream having a temperature lower than thereceived compressed air; and a dry air tube enclosing the cold airexhaust tube, wherein the dry air inside the dry air tube continuouslyflows surrounding the cold air tube.
 4. A vortex cooling system asdescribed in claim 1, wherein the vortex unit further comprises a valveconstructed on the end of the hot air exhaust tube to control the coldfraction of the hot air in the hot air exhaust tube and the cold air inthe cold air exhaust tube.